Plasma Enhances Chemical Vapor Deposition(PECVD) date for Oxford PECVD PS100. Deposition data available for SiO₂, Si₃N₄,SiC,PolySi.

PECVD Characterization Data 

Stress measurement for PECVD deposition using the TOHO FLX-2320-S TEMPERATURE MEASUREMENT

PECVD Si₃N₄ Stress Control and Rate Data  

Deposition rate date for the Lesker PVD75 sputtering system. Material deposition rate for SnO₂,Ti/Pt,Cr/Au,Ta,Al,Cu,Ni,Cr,TiW,Fe₂O₃

Sputtering Characterization Data

Atomic Layer Depostion (ALD) deposition data for the BENEQ TFS-200 ALD. Deposition data included for SiO₂,Al₂O₃,ZnO,TiO_2.

ALD Characterization Data

Silicon Dioxide Plasma Etch Guide for Trion and March plasma etching 

Plasma etch rates of SiO₂