Plasma Enhances Chemical Vapor Deposition(PECVD) date for Oxford PECVD PS100. Deposition data available for SiO₂, Si₃N₄,SiC,PolySi.

PECVD Characterization Data 

Stress measurement for PECVD deposition using the TOHO FLX-2320-S TEMPERATURE MEASUREMENT

PECVD Si₃N₄ Stress Control and Rate Data  

Stress measurement of TiW sputtered films in the Lesker PVD 75 for various pressures and substrate bias

TiW Stress Control

Deposition rate date for the Lesker PVD75 sputtering system. Material deposition rate for SnO₂, Ti/Pt, Cr/Au, Ta,Al, Cu, Ni, Cr, TiW, Fe₂O₃

Sputtering Characterization Data

Detailed sputtering data for Sn and Ge in the Lesker PVD 75

Sn and Ge Data

Atomic Layer Depostion (ALD) deposition data for the BENEQ TFS-200 ALD. Deposition data included for SiO₂, Al₂O₃, ZnO, TiO_2.

ALD Characterization Data

Silicon Dioxide Plasma Etch Guide for Trion and March plasma etching 

Plasma etch rates of SiO₂