Characterization Data for Selected Processes and Tools
Plasma Enhances Chemical Vapor Deposition(PECVD) date for Oxford PECVD PS100. Deposition data available for SiO2, Si3N4,SiC,PolySi.
Stress measurement for PECVD deposition using the TOHO FLX-2320-S TEMPERATURE MEASUREMENT
Deposition rate date for the Lesker PVD75 sputtering system. Material deposition rate for SnO2,Ti/Pt,Cr/Au,Ta,Al,Cu,Ni,Cr,TiW,Fe2O3
Atomic Layer Depostion (ALD) deposition data for the BENEQ TFS-200 ALD. Deposition data included for SiO2,Al2O3,ZnO,TiO2.
Aluminum Plasma Etch Guide in the Trion Metal Etcher