Photomasks and Direct Write
A Heidelberg DWL 66FS UV laser patterning system for the generation of photomasks and direct write onto substrates, such as wafers or individual die. The Heidelberg can provide write resolution capabilities down to 600 nm for substrates up to 9” square. Additionally, it can perform the direct write on wafers or individual die and write 128 levels of grayscale.
Suss MA6/BA6 and AB-M mask aligners provide front and backside alignment capabilities. Alignment can be performed on individual die up to 6" wafers.
An ammonia-based photoresist image reversal systems by YES that can also perform HMDS vapor prime.