#ABCDEFGHIJKLMNOPQRSTUVWXYZ

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• 1-Propanol
• 2-Propanol
• 3-Aminopropyltriethoxy-Silane

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A

• Acetic Acid
• Acetone
• Acetylene
• Acid Copper Electroplating Solution
• Alcohol 200 Proof
• Alcohol Anhydrous
• Aluminum
• Aluminum Etch 80-15-3-2
• Aluminum Oxide
• Aluminum Silicon
• Aluminum Silicon Copper
• Al2O3 doped ZnO 98%
• AlTi 70/30
• Aluminum Pellets
• Ammonia Gas
• Ammonium Chloride
• Ammonium Hydroxide
• Amorphous Fluoropolymer Solution
• AP 140 Organosilicon Compound in Isopropanol
• Argon
• AZ 400K Developer
• AZ P4620 Photoresist

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B

• Baker BTS-220
• Bis(diethylamino) silane (BDEAS)
• BOE Buffered Oxide Etch 6:1
• Boron Trichloride (BCl₃)
• Brass
• Bright Electroless Gold
• γ-Butyrolactone

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C

• Calcium Gluconate (Calgonate)
• Carbon
• Carbon Dioxide
• Chlorine
• Chromium
• Chromium Etchant CR-100
• Chromium Mask Etchant CEP-200
• Cobalt
• Copper
• Copper Etchant Type CE-200
• Copper Pellets
• Crystalbond 509 Mounting Adhesive
• Cyclohexanone

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D

• Dimethyl Sulfoxide
• Dynastrip ™ DL9150B

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E

• Electoless Copper (Solution A, Solution B, Solution C, Solution D)
• Electroless Nickel Concentrate Part A
• Electroless Nickel Concentrate Part B
• Elevate Gold 7990 RTU
• Ethyl Alcohol

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F

• Ferrous Chloride
• Formaldehyde Glutaraldehyde, 2.5% in 0.1M Sod Cac Buffer

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G

• Germanium
• Glycerol
• Gold
• Gold Electroplating Solution 24 Karat
• Gold Etchant GE 8111

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H

• Halocarbon C318 (C₄F₈,Octaflurocyclobutane)
• Halocarbon R23 (CH₃,Trifluoromethane)
• Halocarbon R-11 (CF₄,Trichlorofluoromethane)
• HD-4100
• Helium
• Hexanes
• Hexamethyldisilazane (HMDS)
• Hydrochloric Acid
• Hydrofluoric Acid 49%
• Hydrogen Fluoride 
• Hydrogen Peroxide 30%

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I

• Indium
• InAg 97/3
• Indium Tin Oxide (ITO)
• Indium Tin Oxide Pellets
• Iron
• Iron Oxide

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J

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K

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L

• Liquinox
• LOR 3A

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M

• MC 7680 High Temp Die Attach
• MC 7685 High Temp Attach
• MCC Primer 80/20
• Methane
• Methanol
• MF-319
• Micro Soap 90
• Molybdenum
• Molybdenum pellets
• M-Xylene

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N

• Nickel
• Nickel Chromium
• Nickel Chromium Pellets
• Nickel Etch TFB
• Nickel Iron
• Nickel Pellets
• Nickel Sulfamate RTU
• Nickelex Electroless Nickel Plating Solution
• Nitric Acid
• Nitrogen
• Nitrous Oxide
• NMP (1-Methyl-2-Pyroolidinone, N-Methylpyrrolidinone)
• Norland Optical Adhesive 88

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O

• OCG Thick SC Resist
• OCG Thin HNR120
• Octamethylcyclotetrasiloxane
• Omni Coat
• Oxygen Compressed

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P

• PA 400R
• PA 401D
• Palladium
• Palladium/Silver
• Phosphorous Spin-On Diffusant P8545PV
• PI 2611 Polymide Coating
• Platinum
• Poly(3,4-Ethylenedioxythiophene)-poly(styrenesulfonate)
• Potassium Hydroxide
• Potassium Tetrachloroplatinate
• Propylene Oxide, ACS Reagent

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Q

• QPAC40

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R

• Remover PG
• Resbond 920 powder

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S

• S1805 Photoresist
• S1813 Photoresist
• S1827 Photoresist
• Silane
• Silicon
• Silicon Pieces
• Silicon Dioxide Pellets
• Silicon Nitride
• Silver
• Silver Pellets
• Silver Etchant TFS
• Sodium Bicarbonate
• Sodium Cacodylate Buffer
• Sodium Hydroxide
• Sodium Hypophosphite Monohydrate
• Sodium Silicate Solution
• SPR 220 3.0
• SPR 220 7.0
• SU-8 Developer
• SU-8 Series resist
• SU-8 2000 Series (2000.5, 2005, 2007, 2010, 2015, 2050)
• Sulfur Hexafluoride (SF₆)
• Sulfuric Acid
• Sylgard 184 Silicon Elastomer Kit ( Base + Curing Agent)

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T

• Tantalum
• Tantalum Pellets
• Tetramethylammonium Hydroxide (TMAH)
• Tin
• Tin Oxide
• Tin Pellets
• Titanium
• Titanium Dioxide Pieces
• Titanium Nitride
• Titanium Pellets
• Toluene
• Trichloro(1H,1H,2H,2H-perfluorooctyl)silane
• Tungsten
• Tungsten Pellets
• Tungsten Titanium 10/90

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U

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V

• VM-651 Adhesion Promoter

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W

• WNRD

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X

• Xenon Difluoride

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Y

• Yttrium-Barium-Copper-Oxide (YBCO)

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Z

• Zinc Oxide Pellets
• Zinc Oxide/Aluminum Oxide
• Zinc Sulfide Pellets
• Zirconium
• Zirconium Oxynitrate Hydrate

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