Thin Film Deposition

Plasma Enhanced Chemical Vapor Deposition System

Oxford PECVD system capable of depositing silicon nitride, silicon dioxide, oxynitride, amorphous silicon(undoped/doped), polycrystalline silicon (undoped/doped) and silicon carbide. The Oxford tool includes a 650°C high-temperature chuck and a TEOS delivery system.


Kurt J. Lesker PVD 75 three source tool and Technics two source system for deposition of both metals and dielectrics. The PVD 75 features RF, DC, RF/DC stacking and ion beam assisted sputtering, which includes throttled pressure control and reactive gas mixing.

E-beam Evaporator

Kurt J. Lesker electron beam evaporation system for depositing a variety of thin films on substrates up to 6 inches.

Parylene Coating System

SCS vapor deposition tool for Parylene C.

Molecular Vapor Deposition

Applied MST MVD system for the conformal deposition of hydrophobic coatings for lubricants, anti-stiction layers, molecular glues, reactive adhesion layers, or to change the surface contact angle.

Atomic Layer Deposition

A Beneq ALD system for the deposition of alumina (Al2O3), titanium dioxide (TiO2), zinc oxide(ZnO) and silicon dioxide (SiO2) films.