Thin Film Deposition

Plasma Enhanced Chemical Vapor Deposition System

Oxford PECVD system capable of depositing silicon nitride, silicon dioxide, oxynitride, amorphous silicon(undoped/doped), polycrystalline silicon (undoped/doped) and silicon carbide. The Oxford tool includes a 650°C high-temperature chuck and a TEOS delivery system.

Sputtering

Kurt J. Lesker PVD 75 three source tool and Technics two source system for deposition of both metals and dielectrics. The PVD 75 features RF, DC, RF/DC stacking and ion beam assisted sputtering, which includes throttled pressure control and reactive gas mixing.

E-beam Evaporator

Kurt J. Lesker electron beam evaporation system for depositing a variety of thin films on substrates up to 6”.

Parylene Coating System

SCS vapor deposition tool for Parylene C.

Molecular Vapor Deposition

Applied MST MVD system for the conformal deposition of hydrophobic coatings for lubricants, anti-stiction layers, molecular glues, reactive adhesion layers, or to change the surface contact angle.

Electroplating

Pulse or continuous DC electroplating systems for Cu and Ni processing using high aspect ratio photoresists. Uniformity is not guaranteed.

Atomic Layer Deposition

A Beneq ALD system for the deposition of alumina (Al2O3), titanium dioxide (TiO2), zinc oxide(ZnO) and silicon dioxide (SiO2) films.