Thin Film Deposition

• Evaporation: Thermal and E-beam assisted evaporation of Cr, Au, ITO and many other materials on up to 6" substrates
• Sputtering: RF & DC magnetron sputtering on up to 4” substrates.  Cr, Au, Ti, W, TiW, Pt, YBCO ITO and many others
• Parylene Coating: Vapor Deposition of Parylene C and Parylene N.  parylene deposition provides the capability to conformally coat dielectric and biocompatible layers on fabricated devices.
• Molecular Vapor Deposition:  Deposition of organic surface coatings used  as lubricants, anti-stiction layers, molecular glues, or reactive adhesion layers.
• Electroplating:  MEMS processing for Cr, Au, Cu, and Ni using the IKO electroplating system 

Thermal Processing

• Oxidation and Diffusion:  Thermal processes include wet oxidation, dry oxidation, as well as Boron and Phosphorous diffusion.
• Rapid Thermal Processing (RTP):  For Silicon based gate oxide growth and rapid thermal annealing.
• PECVD: For depositing nitrides and oxides 

Lithography

• Photomasks: 4”, 5”, and 6” masks with linewidths down to 1.0 micron produced with the Hiedelberg DWL66 laser pattern generator.
• Contact Lithography: For individual die to whole 6” wafers.  Our SUSS MA6 and AB-M mask aligners also provide back-to-front alignment capabilities.  Nanometer resolution e-beam lithography also available.
• Maskless Lithography: Intelligent Micro-Patterning SF-100 provides 5 mm linewidth lithography with direct imaging using a DMD.

Etching, Machining and Bonding

• Deep Reactive Ion Etch (Silicon): Silicon DRIE using the Bosch process.  Our STS DRIE has pulsed platen bias to minimize "footing" at oxide etch stops. 

• Anisotropic Silicon Wet Etching: Extensive experience with KOH,TMAH and EDP wet etchants

• MicroMilling: Dover Instruments Ultra-High-Precision Micro Milling Machine is a CNC milling station with nanometer spatial resolution for machining virtually any solid material (i.e. metals, polymers, ceramics, etc.)

• Wafer Level Bonding: Suss MicroTec SB6 for Si/glass anodic bonding, glass/glass thermal compression bonding and Si/Si fusion bonding.

• Plasma Etching: RIE systems are capable of providing selective silicon, SiO2 and Si3N4 etches, as well as ashing processes.

• Xenon Di-Fluoride Etching: Dry anisotropic silicon etching using the Xactix XeF₂ etching system allows for efficient etching of silicon micro-structures prone to stiction.

• Miscellaneous: Nano-imprinting, micro-molding, chemical mechanical polishing, ultra-sonic drilling, etc.

Packaging

• Dicing: Automated Disco Dising Saw for silicon, glass and alternative substrate dicing.
• Wire Bonding: K&S wedge, ball and deep access bonders for aluminum and gold 1-mil wirebonding.
• Flip Chip Packaging: Finetech Fineplacer "pico" System for die placement up to 5um.  Can handle SMCs up to 17 mm side length.
• Printed Circuit Boards: An automated milling system for custom PCB production.
• Lapping and Polishing: Lapmaster system is capable of thinning a variety of substrates, as well as final polishing.

Metrology & Test

• White Light Interferometer Surface Profiling: Veeco Interferometer provides high resolution, 3D surface measurements, from sub-nanometer roughness to millimeter step heights for all reflective substrates.
• 3D Contact Profiling: Veeco Dektak 8 provides down to 7.5 angstrom step height measurements with a v ertical range up to 1mm and a maximum scan length of 200mm.  Low stylus forces allow scratch-free measurement of soft materials.
• Ellipsometry: Non-destructive measurement technique for determining the thickness and optical constants of single and multi-layer films.
• SEM, AFM, STM Capabilities: Various SEMs, AFMs and STMs including nm resolution e-beam lithography.
• Testing: Various probe stations and electronic instruments for measuring sheet resistance, TCR, IV, CV, LCR and other semiconductor parameters.

Design, Layout and Modeling

Full suite of computer-based tools for photomask layout, custom analog and digital IC design, microscale tooling, and 2D/3D finite element models for virtual device evaluation. Software packages include: Tanner EDA, Silvaco TCAD, CoventorWare®, Solid Edge.